TSMC to start construction of first European chip plant in August

TAIPEI -- Taiwan Semiconductor Manufacturing Co. will hold a groundbreaking ceremony next month in Dresden, Germany, for its first plant in Europe, the latest milestone as the world's top chipmaker expands its global production footprint, sources briefed on the matter told Nikkei Asia.

TSMC Chairman and CEO C.C. Wei will lead a delegation from the company and host equipment and material suppliers, clients and government officials on Aug. 20 in a sign of the chipmaker's commitment to its investment in Germany, sources said. The Dresden plant -- formally known as European Semiconductor Manufacturing Corp. (ESMC) -- is scheduled to go into operation by late 2027.