Hong Kong chip fab raises U.S. research security concerns: report

NEW YORK -- A Chinese scientist who worked on developing photonic technology for the U.S. military is now leading a third-generation semiconductor chip production venture in Hong Kong, raising concerns about U.S. research security, according to a defense policy group in Washington.

Liao Yitao, a former Boston University researcher, will spearhead a new facility producing chip technology crucial for advanced semiconductors in Hong Kong that is set to be operational this year.