US to target ChangXin Memory in next chip curb

The United States is stepping up its efforts to prevent China from accessing advanced chip technologies that can make gate-all-around (GAA) transistors and high-bandwidth memory (HBM) chips.

One of the key targets of Washington’s potential curb will be the Hefei-based ChangXin Memory Technologies Inc (CXMT), which produces DRAM for use in computer servers and smart vehicles, according to media reports. CXMT’s major competitors include Samsung Electronics, SK hynix and Micron.

Alan Estevez, chief of the US Commerce Department’s Bureau of Industry and Security (BIS), recently visited the Netherlands to discuss adding 11 more Chinese chip making factories to a restricted list, Reuters reported Tuesday. Estevez then went to Japan to discuss the same matter.

Bloomberg reported Wednesday that Estevez’s mission is to press the Japanese and Dutch governments to put more limits on the China shipments of Tokyo Electron Ltd and ASML, respectively. It said Estevez’s ongoing dialogue with allies will highlight Chinese chip factories development of so-called high-bandwidth memory (HBM) chips, which can be used as artificial intelligence (AI) accelerators.

Reuters reported last month that CXMT and Wuhan Xinxin Semiconductor Manufacturing Co (XMC), the latter a subsidiary of flash memory chipmaker Yangtze Memory Technologies Co (YMTC), are at the early stages of producing HBM chips and are trying to source tools from South Korea and Japan.

It said CXMT has partnered with chip packaging and testing company Tongfu Microelectronics to develop sample HBM chips and has showcased them to clients. In February, XMC began constructing a factory that can make 3,000 12-inch HBM wafers per month.

Currently, five Chinese chip makers, including