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Advanced IC packaging is a hot new source of competition among manufacturers of AI processors and other advanced integrated circuits (ICs), and emerging as the next front in the US government’s efforts to reduce America’s dependence on foreign suppliers and retard China’s technological progress.
South Korea’s Hyundai Motor is building a complete electric vehicle (EV) supply chain in Indonesia, a drive in line with the Southeast Asian nation’s policy of moving away from raw mineral exports and into more value-added production.
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Germany’s Infineon Technologies has started production at the first phase of its new fab in Kulim, Malaysia, which it expects to become the largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor production facility in the world.
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Ambassadors to Japan from the other G7 nations – the US, UK, Canada, Germany, France and Italy – refused to attend Friday’s (August 9) peace ceremony in Nagasaki because the Israeli ambassador had not been invited. The only other countries not invited were Russia and Belarus.
The Okinawa Institute of Science and Technology (OIST) has designed a new type of extreme ultraviolet (EUV) lithography equipment that could significantly reduce the cost to produce 7nm and smaller semiconductors, and thus revolutionize the chip manufacturing supply chain.
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